Electronics Trends Contents
Published: Jan 5, 2010
Summary
A summarry of technology needs, developments and a quantification of the opprtunities up to 2014. Including PCB, HDI,Flex, Flex Rigid, IC Packaging Flip Chip, CSP,WLCSP,BGA and 3D packaging forecasts. Report includes System. Package and substrate Technology Road Maps
Description
A summarry of technology needs, developments and a quantification of the opprtunities up to 2014. Including PCB, HDI,Flex, Flex Rigid, IC Packaging Flip Chip, CSP,WLCSP,BGA and 3D packaging forecasts.
| Report | None |
| Brochure | None |
| Contents | IC_Packaging_2009_Contents_List_2.pdf |
| Order Form | None |