Materials & Process Equipment
- Advanced materials for electronic and optical applications
- Materials with enhanced thermal management properties
- PCB materials – dielectric, soldermasks, coverlays
- Device materials – GaN, SiGe, SOI
- Low k dielectric materials
- Advanced electronic assembly equipment
- Optical component assembly equipment
- Semiconductor packaging materials
- Assembly materials – solders, conductive adhesives
- Laser and plasma processes applications
