Systems

BPA has a solid understanding of the technical and commercial issues influencing the future construction, market demand and technology roadmaps for the following system categories:

  • Semiconductors and device fabrication
  • RF components and sub-assemblies
  • Semiconductor packaging and test
  • Optical device packaging and test
  • High density substrates and interconnect – rigid and flexible
  • Embedded optical waveguides – PCBs and backplanes
  • High density connectors
  • Optical components and sub-assemblies
  • Automotive entertainment and safety systems
  • Micro-systems technologies – nanotechnology, MEMs and micro-optic components
  • Passive components – integrated and embedded solutions
  • Electro-mechanical components – relays, switches
  • Antennae components

Components Image #2

Components Image #1


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